• DocumentCode
    1396285
  • Title

    Efficient Signal Transport Model for Remote Thermometry in Full-Scale Thermal Processing Systems

  • Author

    Erturk, Hakan ; Howell, John R.

  • Author_Institution
    Dept. of Mech. Eng., Bogazici Univ., Istanbul, Turkey
  • Volume
    23
  • Issue
    1
  • fYear
    2010
  • Firstpage
    132
  • Lastpage
    140
  • Abstract
    The rapid thermal processing of semiconductor devices is very temperature sensitive and requires precise temperature measurement. Light pipe radiation thermometers are widely used for temperature control during manufacturing by industry, and there is concern about errors associated with light pipe measurements. Modeling in simplified systems has helped in understanding the signal transport process in light pipes and errors associated with measurements in the past. Considering the small sensor area compared to the size of the semiconductor wafer and the remaining system components, modeling of the complete system has not been done due to the computational demand. A reverse Monte Carlo model can be used efficiently to model the signal transported to the photodetector in conjunction with a thermal model of the system to better characterize the system. The proposed method is demonstrated in a full-scale instrumented system with a light pipe thermometer, and the results are compared against previously published measurements from the system.
  • Keywords
    Monte Carlo methods; photodetectors; pipes; semiconductor device manufacture; semiconductor device measurement; temperature control; temperature measurement; full-scale instrumented system; full-scale thermal processing systems; light pipe radiation thermometers; photodetector; remote thermometry; reverse Monte Carlo model; semiconductor devices; signal transport model; temperature control; temperature measurement; Light pipe radiation thermometers; radiative transfer; rapid thermal processing; remote thermometry;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2009.2039183
  • Filename
    5398966