Ultra-Wideband Power Divider Using Multi-Wafer Packaging Technology

A compact ultra-wideband Wilkinson power combiner/divider is first demonstrated using a hermetic multi-wafer wafer level packaging technology. Its bandwidth is broadened to around 2-22 GHz with a maximum VSWR around 2:1, by using a multi-section design approach. A total of four sections are adopted to achieve better than 20 dB isolation between output ports across the majority of a 3-19 GHz band. The first two stages are implemented on the first wafer, with the last two stages on the second wafer. This configuration significantly reduces the chip size and volume and makes the multi-section wideband divider viable for monolithic microwave integrated circuit implementation. To the authors´ knowledge, this is the smallest Wilkinson power divider ever reported for such a wide bandwidth.