DocumentCode :
1397401
Title :
Transient eddy current analysis for generalized structures using surface impedances and the fast Fourier transform
Author :
Davey, Kent R. ; Turner, Larry
Author_Institution :
Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
26
Issue :
3
fYear :
1990
fDate :
5/1/1990 12:00:00 AM
Firstpage :
1164
Lastpage :
1170
Abstract :
Surface impedances have primarily been utilized in eddy current problems, where the skin depth is small compared to the conductor thickness being modeled. Their use is extended to arbitrary-thickness conductors. In addition, the authors investigated modeling different shapes as combinations of slabs. In particular, a cylinder was emulated as a polygon of slabs to verify the versatility of the technique. The application to sinusoidal steady-state problems is straightforward. Of greater interest is the extension to the transient problem. A solution was sought via the fast Fourier transform. With the surface impedance method, the calculation of each frequency solution is fast; the overhead required in setting up the problem, albeit the integral or finite-element matrix is geometry-dependent only, and need be performed but once. The calculation of the transient response of a cylinder placed in an exponentially decaying field is computed and compared to analytic results. Some discussion is given on the benefits of breaking up the excitation field into parts that start and end at the same level
Keywords :
eddy currents; electric impedance; fast Fourier transforms; transient response; arbitrary-thickness conductors; conductor thickness; cylinder; eddy current analysis; exponentially decaying field; fast Fourier transform; finite-element matrix; integral; polygon; skin depth; slabs; steady-state problems; surface impedances; transient problem; transient response; Conductors; Eddy currents; Fast Fourier transforms; Frequency; Shape; Skin; Slabs; Steady-state; Surface impedance; Transient analysis;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.53994
Filename :
53994
Link To Document :
بازگشت