DocumentCode
1398659
Title
Fabrication and analysis of hollow microneedles and polymeric piezoelectric valveless micropump for transdermal drug-delivery system
Author
Ashraf, Muhammad Waseem ; Tayyaba, S. ; Nisar, A. ; Afzulpurkar, Nitin
Author_Institution
Dept. of Phys. (Electron.), GC Univ. Lahore, Lahore, Pakistan
Volume
6
Issue
18
fYear
2012
Firstpage
3248
Lastpage
3256
Abstract
This study presents the fabrication and analysis of silicon hollow microneedles and polymeric piezoelectric valveless micropump for microelectromechanical (MEMS)-based transdermal drug-delivery (TDD) system. The proposed TDD system consists of integrated control electronics and MEMS devices such as micropump, microneedles, blood pressure sensor and fluid flow sensor. Microneedles and micropump are the most essential and critical components of the proposed TDD system. Mechanical strength of microneedles has been investigated in structural analysis. Inductively coupled plasma technology has been used to fabricate high aspect ratio silicon hollow microneedles. The numerical analysis of micropump has been done by building three-dimensional electro-fluid-solid model. The experimental performance of fabricated polymeric piezoelectric valveless micropump with different pump chamber diameters has been characterised in terms of actuator deflection and flow rate at different operational parameters.
Keywords
bioMEMS; biomedical electronics; blood pressure measurement; drug delivery systems; flow sensors; microfabrication; micropumps; needles; piezoelectric actuators; plasma materials processing; pressure sensors; 3D electro-fluid-solid model; MEMS based TDD system; MEMS based transdermal drug delivery system; MEMS devices; actuator deflection; blood pressure sensor; flow rate; fluid flow sensor; high aspect ratio silicon hollow microneedles; inductively coupled plasma technology; integrated control electronics; microelectromechanical system; microneedle mechanical strength; micropump numerical analysis; polymeric piezoelectric valveless micropump; structural analysis;
fLanguage
English
Journal_Title
Communications, IET
Publisher
iet
ISSN
1751-8628
Type
jour
DOI
10.1049/iet-com.2011.0177
Filename
6412955
Link To Document