DocumentCode
1398926
Title
Cold pressure-welding and its influence on device design and manufacture
Author
Boswell, D. ; Humphrey, R.
Volume
106
Issue
15
fYear
1959
fDate
5/1/1959 12:00:00 AM
Firstpage
454
Lastpage
458
Abstract
A brief discussion of the effects of cold welding on container design is followed by considerations of tool design and an assessment of the process on a production scale. Surface preparation and component dimensional control are prime considerations.
Keywords
semiconductor devices; welding;
fLanguage
English
Journal_Title
Proceedings of the IEE - Part B: Electronic and Communication Engineering
Publisher
iet
ISSN
0369-8890
Type
jour
DOI
10.1049/pi-b-2.1959.0098
Filename
5244286
Link To Document