Title :
A semi-active hybrid neuroprosthesis for restoring lower limb function in paraplegics
Author :
Kirsch, Nicholas ; Alibeji, Naji ; Fisher, Lee ; Gregory, Chris ; Sharma, Neelam
Author_Institution :
Dept. of Mech. Eng. & Mater. Sci., Univ. of Pittsburgh, Pittsburgh, PA, USA
Abstract :
Through the application of functional electrical stimulation (FES) individuals with paraplegia can regain lost walking function. However, due to the rapid onset of muscle fatigue, the walking duration obtained with an FES-based neuroprosthesis is often relatively short. The rapid muscle fatigue can be compensated for by using a hybrid system that uses both FES and an active orthosis. In this paper, we demonstrate the initial testing of a semi-active hybrid walking neuroprosthesis. The semi-active hybrid orthosis (SEAHO) supports a user during the stance phase and standing while the electric motors attached to the hip section of the orthosis are used to generate hip flexion/extension. FES in SEAHO is mainly used to actuate knee flexion/extension and plantar flexion of the foot. SEAHO is controlled by a finite state machine that uses a recently developed nonlinear controller for position tracking control of the hip motors and cues from the hip angle to actuate FES and other components.
Keywords :
bioelectric phenomena; biomedical electronics; bone; electric motors; fatigue; finite state machines; gait analysis; muscle; neurophysiology; orthopaedics; orthotics; prosthetics; FES-based neuroprosthesis; electric motors; finite state machine; functional electrical stimulation; hip flexion-extension; hip motors; knee flexion-extension; muscle fatigue; nonlinear controller; paraplegia; plantar flexion; position tracking control; restoring lower limb function; semiactive hybrid orthosis; semiactive hybrid walking neuroprosthesis; stance phase; Exoskeletons; Hip; Knee; Legged locomotion; Muscles; Spinal cord injury; Springs;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
DOI :
10.1109/EMBC.2014.6944144