DocumentCode
1399097
Title
Junction degradation in bipolar transistors and the reliability imposed constraints to scaling and design
Author
Tang, Denny Duan-Lee ; Hackbarth, Edward
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
35
Issue
12
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
2101
Lastpage
2107
Abstract
The stress-induced leakage current is predominantly a Shockley-Read-Hall-like generation-recombination current. As the stress progresses, the leakage current increases, eventually reaches a maximum and then decays. The leakage current lowers the current gain at low biases. It affects the narrow-emitter transistors more since it is proportional to the emitter edge length. But, its impact is less significant if the transistor is operated at a high V be , as required by constant-current scaling. The loss of the current gain does not affect the circuit speed directly. Instead, it reduces the logic swing and thus the noise margin of the circuit. The design to absorb the degradation with a larger initial logic swing results in a speed penalty. The reverse-stress-induced junction degradation can be eliminated by properly designing the circuit There is no concern for emitter-coupled logic (ECL) circuits when the logic swing is less than the V be of the transistors
Keywords
bipolar integrated circuits; emitter-coupled logic; integrated circuit technology; integrated logic circuits; semiconductor technology; ECL; Shockley-Read-Hall-like generation-recombination current; bipolar transistors; circuit speed; constant-current scaling; current gain; emitter-coupled logic; junction degradation; logic swing; narrow-emitter transistors; noise margin; reliability imposed constraints; reverse-stress-induced junction degradation; speed penalty; stress-induced leakage current; Bipolar transistors; Circuit noise; Circuit synthesis; Degradation; Doping; Leakage current; Logic circuits; Noise reduction; Stress; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.8783
Filename
8783
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