• DocumentCode
    1399513
  • Title

    Miniaturised 45° power divider using three-dimensional MMIC technology

  • Author

    Hayashi, H. ; Piernas, B. ; Nishikawa, K. ; Nakagawa, T.

  • Author_Institution
    NTT Network Innovation Labs., Kanagawa, Japan
  • Volume
    36
  • Issue
    21
  • fYear
    2000
  • fDate
    10/12/2000 12:00:00 AM
  • Firstpage
    1785
  • Lastpage
    1787
  • Abstract
    A miniaturised 45° power divider using three-dimensional MMIC technology is described. The divider comprises stacked thin-film microstrip lines that sandwich a ground plane between them. It has an area of only 0.43 mm2, and it exhibits a coupling of 4.5±0.2 dB and a phase difference of 45±1° from 28 to 33 GHz
  • Keywords
    MMIC; microstrip components; millimetre wave devices; power dividers; 28 to 33 GHz; 3D MMIC technology; 45 degree power divider; K-band; miniaturised power divider; sandwiched ground plane; stacked thin-film microstrip lines; three-dimensional MMIC technology;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20001189
  • Filename
    878567
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1399513