• DocumentCode
    140010
  • Title

    Wearable static posturography solution using a novel pressure sensor sole

  • Author

    Reinfelder, Samuel ; Durlak, Felix ; Barth, Jens ; Klucken, Jochen ; Eskofier, Bjorn M.

  • Author_Institution
    Dept. of Comput. Sci., Friedrich-Alexander Univ. Erlangen-Nurnberg (FAU), Erlangen, Germany
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    2973
  • Lastpage
    2976
  • Abstract
    Static posturography is an important measurement in the diagnostic workup for patients with postural instability. New wearable sensor technologies enable researchers to use in-shoe pressure soles in the home environment and outdoor applications. In this study a newly developed in-shoe pressure sole was used for calculating the sway path and 95 % confidence ellipse area as the standard parameters of typical static posturography. Insole posturography was validated on 24 subjects by a state of the art pressure plate assessment during three static posturography conditions (eyes open, eyes closed and barefoot). The adaptive low pass filtered data resulted in an overall correlation of 0.63 to 0.78 for the sway path and 0.66 to 0.79 for the 95 % confidence ellipse area. Individual correlations of up to 0.97 for the sway path and 0.99 for the 95 % confidence ellipse area could be obtained. Future applications could utilize the mobile advantage of in-shoe pressure soles and measure static and dynamic posturography in clinical and home environments.
  • Keywords
    body sensor networks; mechanoception; pressure sensors; telemedicine; adaptive low pass filtered data; in-shoe pressure sensor sole; postural instability; wearable sensor technologies; wearable static posturography solution; Atmospheric measurements; Correlation; Cutoff frequency; Educational institutions; Footwear; Pressure measurement; Standards;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6944247
  • Filename
    6944247