DocumentCode
1400371
Title
Reliability of vapor-grown planar In/sub 0.53/Ga/sub 0.47/As/InP p-i-n photodiodes with very high failure activation energy
Author
Forrest, Stephen R. ; Ban, V.S. ; Gasparian, G. ; Gay, Daniel ; Olsen, Gregory H.
Author_Institution
Dept. of Electr. Eng. & Mat. Sci., Univ. of Southern California, Los Angeles, CA, USA
Volume
9
Issue
5
fYear
1988
fDate
5/1/1988 12:00:00 AM
Firstpage
217
Lastpage
219
Abstract
The mean time to failure (MTTF) was measured for a statistically significant population of planar In/sub 0.53/Ga/sub 0.47/As/InP heterostructure p-i-n photodetectors at several elevated temperatures. The probability for failure is fit to a log-normal distribution, with the result that the width of the failure distribution is sigma =0.55+or-0.2, and is roughly independent of temperature. From the temperature dependence of MTTF data, it is found that the failure mechanism is thermally activated, with an activation energy of less than 1.5+or-0.2 eV measured in the temperature range of 170-250 degrees C. This extrapolates to a MTTF of less than 0.1 failure in 10/sup 9/ h (or <0.1 FIT) at 70 degrees C, indicating that such devices are useful for systems requiring extremely high reliable components, even if operated at elevated temperatures for significant time periods. This activation energy is the highest value reported for In/sub 0.53/Ga/sub 0.47/As/InP photodetectors, and is significantly higher than the energies of approximately 0.85 eV often suspected for these devices.<>
Keywords
III-V semiconductors; failure analysis; gallium arsenide; indium compounds; photodetectors; photodiodes; reliability; semiconductor device testing; 1.5 eV; 170 to 250 degC; In/sub 0.53/Ga/sub 0.47/As-InP; activation energy; failure distribution; heterostructure p-i-n photodetectors; mean time to failure; planar p-i-n photodiodes; reliability; temperature dependence; thermally activated failure mechanism; Failure analysis; Indium phosphide; Log-normal distribution; PIN photodiodes; Photodetectors; Probability; Temperature dependence; Temperature distribution; Temperature measurement; Time measurement;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.695
Filename
695
Link To Document