Backside optical measurements of picosecond internal gate delays in a flip-chip packaged silicon VLSI circuit

Author

Heinrich, H.K. ; Pakdaman, N. ; Kent, D.S. ; Cropp, L.M.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

3

Issue

7

fYear

1991

fDate

7/1/1991 12:00:00 AM

Firstpage

673

Lastpage

675

Abstract

A report is presented of the backside optical measurements of internal gate propagation delays in a flip-chip mounted silicon integrated circuit. Both gate delays and risetimes agreed well with prior simulations. However, the measurements displayed additional features on the signals that were not seen in the simulations, such as feedforward through devices, signal over/undershoot, and circuit switching noise on the power supply.<>

Keywords

VLSI; bipolar integrated circuits; delays; emitter-coupled logic; flip-chip devices; integrated circuit testing; logic testing; measurement by laser beam; ECL logic gate; Si; backside optical measurements; circuit switching noise; feedforward; flip chip packaged VLSI circuit; internal gate propagation delays; laser probe; power supply; risetimes; signal overshoot; signal undershoot; Circuit simulation; Integrated circuit measurements; Integrated circuit packaging; Integrated optics; Noise measurement; Photonic integrated circuits; Power measurement; Propagation delay; Silicon; Very large scale integration;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.87950

Filename

87950