• DocumentCode
    1400743
  • Title

    Device and Circuit Co-Design Robustness Studies in the Subthreshold Logic for Ultralow-Power Applications for 32 nm CMOS

  • Author

    Vaddi, Ramesh ; Dasgupta, S. ; Agarwal, R.P.

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Indian Inst. of Technol., Roorkee, India
  • Volume
    57
  • Issue
    3
  • fYear
    2010
  • fDate
    3/1/2010 12:00:00 AM
  • Firstpage
    654
  • Lastpage
    664
  • Abstract
    Digital circuits operating in a subthreshold region have gained wide interest due to their suitability for applications requiring ultralow power consumption with low-to-medium performance criteria. It has been demonstrated that by appropriately optimizing the devices for subthreshold logic, total energy consumption can be reduced significantly. One of the major concerns for subthreshold circuit design is increased sensitivity to process, voltage, and temperature (PVT) variations. In this paper, we critically study the effect of variations of different device and environmental parameters like gate oxide thickness, channel length, threshold voltage, supply voltage, temperature, and reverse body bias on subthreshold circuit performance for 32 nm bulk CMOS. From the study, we conclude that alternative devices like double-gate silicon-on-insulator (DGSOI) are better candidates in terms of performance, robustness and PVT insensitivity as compared to bulk circuits for both static CMOS and pseudo NMOS logic families. We also study the performance and robustness comparisons of bulk CMOS and DGSOI subthreshold basic logic gates with and without parameter variations and we observe 60-70% improvement in power delay product and roughly 50% better tolerance to PVT variations of DGSOI subthreshold logic circuits compared to bulk CMOS subthreshold circuits at the 32 nm node.
  • Keywords
    CMOS logic circuits; energy consumption; logic design; low-power electronics; silicon-on-insulator; DGSOI subthreshold logic circuits; PVT insensitivity; bulk circuits; channel length; circuit co-design robustness study; digital circuits; double-gate silicon-on-insulator; energy consumption; gate oxide thickness; low-to-medium performance criteria; power delay product; pseudo NMOS logic; reverse body bias; size 32 nm; static CMOS; subthreshold circuit design; supply voltage; temperature; threshold voltage; ultralow power consumption; ultralow-power applications; CMOS logic circuits; Circuit optimization; Circuit synthesis; Digital circuits; Energy consumption; Logic devices; Robustness; Silicon on insulator technology; Temperature sensors; Threshold voltage; Device/circuit co-design; HSPICE; double-gate silicon-on-insulator (DGSOI); process, voltage, and temperature (PVT) variations; robust; subthreshold logic; ultralow power;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2039529
  • Filename
    5404208