Title :
An interference management protocol for multiple physical layers in IEEE 802.15.4g smart utility networks
Author :
Chin-Sean Sum ; Harada, Hiroshi ; Kojima, Fumihide ; Liru Lu
Abstract :
This article reports on the technical design and analysis of an interference management protocol that enables interference avoidance among multiple PHY layer designs in the recently completed IEEE 802.15.4g standard for smart utility networking (SUN). The IEEE 802.15.4g system employs three alternate PHY layer designs for enhanced SUN implementation and deployment targeting different market segments. First, SUN is introduced from different perspectives concerning technology, regulation, and the standardization process. Updates on the IEEE 802.15.4g standardization activities, the SUNrelated rules and regulations, and a summary of system design are presented. Next, the interference management protocol for multi-PHY-layer design in a single network is described and discussed. The impact of interference due to coexisting multiple PHY layer designs is highlighted. The operational procedure and mechanism of the management protocol, known as Multi-PHY Management (MPM), are then described. Finally, performance analysis in the presence of MPM is provided and discussed to justify its significance. It is anticipated that in the near future, this interference management approach will be put to field test and then deployed to provide solutions to mitigate interference among different PHY layer designs in SUN.
Keywords :
Zigbee; interference suppression; protocols; standardisation; telecommunication network management; IEEE 802.15.4g smart utility networks; IEEE 802.15.4g standardization process; IEEE 802.15.4g system; MPM; enhanced SUN implementation; field test; interference avoidance; interference management protocol approach; interference mitigation; multiPHY management; multiple PHY layer designs; multiple physical layers; Digital audio broadcasting; Frequency shift keying; IEEE 802.15 Standards; Interference; OFDM; Protocols; System analysis and design;
Journal_Title :
Communications Magazine, IEEE
DOI :
10.1109/MCOM.2013.6495765