• DocumentCode
    1401013
  • Title

    Modeling hot-carrier effects in polysilicon emitter bipolar transistors

  • Author

    Burnett, J.D. ; Hu Chenming

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
  • Volume
    35
  • Issue
    12
  • fYear
    1988
  • fDate
    12/1/1988 12:00:00 AM
  • Firstpage
    2238
  • Lastpage
    2244
  • Abstract
    In self-aligned polysilicon emitter transistors a large electric field existing at the periphery of the emitter-base junction under reverse bias can create hot-carrier-induced degradation. The degradation of polysilicon emitter transistor gain under DC stress conditions can be modelled by ΔIBIR m+ntn where n≈0.5 and m ≈0.5. The more complex relationships of Δβ(I C, IR, t) and β(I C, IR, t) result naturally from the simple ΔIB model. Using these relationships the device lifetime can be extrapolated over a wide range of reverse stress currents for a given technology
  • Keywords
    bipolar transistors; elemental semiconductors; hot carriers; semiconductor device models; silicon; DC stress conditions; device lifetime estimation; emitter-base junction; hot-carrier effects; hot-carrier-induced degradation; modelling; poly-Si emitter bipolar transistors; polycrystalline Si; reverse bias; reverse stress currents; Artificial intelligence; Bipolar transistors; Degradation; Etching; Hot carrier effects; Hot carriers; Implants; Performance evaluation; Predictive models; Stress;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.8798
  • Filename
    8798