DocumentCode
1401013
Title
Modeling hot-carrier effects in polysilicon emitter bipolar transistors
Author
Burnett, J.D. ; Hu Chenming
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
Volume
35
Issue
12
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
2238
Lastpage
2244
Abstract
In self-aligned polysilicon emitter transistors a large electric field existing at the periphery of the emitter-base junction under reverse bias can create hot-carrier-induced degradation. The degradation of polysilicon emitter transistor gain under DC stress conditions can be modelled by ΔI B∝I R m+nt n where n ≈0.5 and m ≈0.5. The more complex relationships of Δβ(I C, I R, t ) and β(I C, I R, t ) result naturally from the simple ΔI B model. Using these relationships the device lifetime can be extrapolated over a wide range of reverse stress currents for a given technology
Keywords
bipolar transistors; elemental semiconductors; hot carriers; semiconductor device models; silicon; DC stress conditions; device lifetime estimation; emitter-base junction; hot-carrier effects; hot-carrier-induced degradation; modelling; poly-Si emitter bipolar transistors; polycrystalline Si; reverse bias; reverse stress currents; Artificial intelligence; Bipolar transistors; Degradation; Etching; Hot carrier effects; Hot carriers; Implants; Performance evaluation; Predictive models; Stress;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.8798
Filename
8798
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