Abstract :
The need for microminiaturization is discussed and the three main approaches to this are briefly described. The problem of the manufacture of a highly reliable microminiature digital integrator using transistors and the microcircuit technique is discussed and the circuit reliability consideration analysed. The microminiature transistor and diode are described and the design of passive components considered under the headings: substrates, resistors, conductors and capacitors, and some of their properties are described. Finally, a brief outline of the special problems of interconnection and encapsulation is given.
