DocumentCode :
1401214
Title :
Automatic Compensation of the Voltage Attenuation in 3-D Interconnection Based on Capacitive Coupling
Author :
Scarselli, Eleonora Franchi ; Gnudi, Antonio ; Natali, Federico ; Scandiuzzo, Mauro ; Canegallo, Roberto ; Guerrieri, Roberto
Author_Institution :
ARCES, Univ. of Bologna, Bologna, Italy
Volume :
46
Issue :
2
fYear :
2011
Firstpage :
498
Lastpage :
506
Abstract :
An architecture to compensate the voltage attenuation introduced by 3-D capacitive coupling is proposed. The scheme is based on a calibration channel which sets the gain of the variable gain amplifiers of the signal channels in such a way as to compensate for the voltage attenuation. Based on this architecture, a prototype has been designed aimed at demonstrating that 3-D technology based on capacitive coupling allows one to transmit analog signals as well as digital ones. CMOS 90 nm technology was used and 3-D assembly is done at die level using a face to face stacking procedure. The area of each signal channel and of the calibration channel is 90 × 30 μm2 and 138 × 191 μm2, respectively, with a power consumption of 1 mW and 3.6 mW. A gain error within 10% of the nominal value was measured for signal amplitudes varying from 200 mV to 1 V in the 100 kHz to 20 MHz range.
Keywords :
CMOS integrated circuits; amplifiers; capacitance; coupled circuits; integrated circuit interconnections; three-dimensional integrated circuits; 3D assembly; 3D capacitive coupling; 3D interconnection; CMOS technology; Capacitive Coupling; analog signal; automatic compensation; calibration channel; power 1 mW; power 3.6 mW; size 90 nm; variable gain amplifier; voltage 200 mV to 1 V; voltage attenuation; Three-dimensional (3-D) integration; capacitive interconnection; system-in-package (SiP);
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2010.2091351
Filename :
5664811
Link To Document :
بازگشت