DocumentCode :
1401374
Title :
Effect of Au thickness on laser beam penetration in semiconductor laser packages
Author :
Cheng, Wood-Hi ; Wang, Szu-Chun ; Yang, Yi-Dian ; Chi, Sien ; Sheen, Maw-Tyan ; Kuang, Jao-Hwa
Author_Institution :
Dept. of Electro.-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume :
20
Issue :
4
fYear :
1997
fDate :
11/1/1997 12:00:00 AM
Firstpage :
396
Lastpage :
402
Abstract :
Comprehensive measurements of the dependence of the weld width, penetration depth, and joint strength on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating. A finite-element method (FEM) has been carried out on the effect of Au thickness on laser beam penetration in Invar-Invar joints. This method has been employed successfully to predict the laser beam penetration in laser welded Au-coated materials that the weld width and the penetration depth are reduced as the Au coating thickness increases. The likely cause for the reduction is the increased thermal conduction of thicker Au in the welded region. In addition to Au coating, the effect of Ni coating on laser beam penetration is also presented. Detailed knowledge of the effect of Au coating thickness on laser beam penetration is important for the practical design and fabrication of reliable optoelectronic packaging having laser welded Au-coated materials
Keywords :
Invar; finite element analysis; gold; heat conduction; laser beam welding; mechanical strength; metallic thin films; microassembling; nickel; semiconductor device packaging; semiconductor lasers; temperature distribution; Au; Au coating thickness; Au thickness effect; FEM; FeNi; Invar-Invar joints; Ni; Ni coating; finite-element method; joint strength; laser beam penetration; penetration depth; reliable optoelectronic packaging; semiconductor laser packages; thermal conduction; thin Au coating; weld width; Coatings; Conducting materials; Finite element methods; Gold; Laser beams; Optical materials; Semiconductor device packaging; Semiconductor lasers; Thickness measurement; Welding;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.641507
Filename :
641507
Link To Document :
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