Title :
The packaging of large spot-size optoelectronic devices
Author :
Collins, John V. ; Lealman, Ian F. ; Fiddyment, Phil J. ; Thurlow, Adrian R. ; Ford, Colin W. ; Rogers, Dave C. ; Jones, Carole A.
Author_Institution :
Labs., BT&D Technol. Ltd., Ipswich, UK
fDate :
11/1/1997 12:00:00 AM
Abstract :
The demand for more bandwidth to the home is starting to drive optical fiber telecommunication systems further into the access network. For fiber systems to reach directly into customer premises the cost of the optoelectronic receivers and transmitters have to be significantly reduced. The major cost of producing these components is the active alignment step to couple an optical fiber to the semiconductor device. This paper details how by matching the output radiation pattern of the device to the input radiation pattern of an optical fiber low-cost passive alignments processes can be utilized
Keywords :
optical fibre subscriber loops; optical fibres; optical transmitters; optoelectronic devices; semiconductor device packaging; semiconductor lasers; fibre to the home; input radiation pattern; large spot-size optoelectronic devices; low-cost passive alignments processes; optical fiber alignment; optoelectronic packaging; output radiation pattern; radiation pattern matching; Bandwidth; Costs; Optical coupling; Optical fiber communication; Optical fiber devices; Optical fibers; Optical receivers; Optical transmitters; Optoelectronic devices; Packaging;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
