DocumentCode
1401394
Title
Rheological characterization of solder pastes for surface mount applications
Author
Kolli, Venkata Giri ; Gadala-Maria, Francis ; Anderson, Ruth
Author_Institution
Dept. of Chem. Eng., South Carolina Univ., Columbia, SC, USA
Volume
20
Issue
4
fYear
1997
fDate
11/1/1997 12:00:00 AM
Firstpage
416
Lastpage
423
Abstract
Accurate rheological measurements are needed in order to correlate the rheological behavior of solder pastes to their performance in the surface mount technology (SMT) process. In this paper, we summarize our efforts to measure the rheological properties of solder pastes, and outline the difficulties in obtaining their true rheological properties. In particular, we show that the rheological measurements of solder pastes are affected by “slip” at the test-apparatus surfaces and by shear fracture within the sample which have not been taken into consideration heretofore
Keywords
fracture; materials testing; rheology; soldering; surface mount technology; SMT process; rheological characterization; rheological measurements; shear fracture; solder pastes; surface mount applications; Costs; Particle measurements; Printed circuits; Production; Rheology; Soldering; Surface cracks; Surface-mount technology; Suspensions; Testing;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.641510
Filename
641510
Link To Document