DocumentCode :
140175
Title :
Internal muscle activity imaging from multi-channel surface EMG recordings: A validation study
Author :
Yang Liu ; Yong Ning ; Jinbao He ; Sheng Li ; Ping Zhou ; Yingchun Zhang
Author_Institution :
Biomed. Eng. Dept., Univ. of Houston, Houston, TX, USA
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
3559
Lastpage :
3561
Abstract :
The developed muscle activity imaging approach (MAI) was validated with surface EMG and intramuscular EMG signals simultaneously acquired from the biceps of a healthy male subject. 128 unipolar channels were employed for surface EMG measurement and one bipolar channel was employed for simultaneous intramuscular EMG measurement for the validation purpose. Ultrasound scans were also specifically performed to localize the location of the wire electrode inserted into the biceps. The surface EMG measurements, after noise filtering and signal decomposition, were used to reconstruct the internal muscle activities for the biceps by using the MAI approach. The locations of the reconstructed muscle activities were compared against the location of the wire electrode in the biceps identified from ultrasound images. Results demonstrate the feasibility and validity of the MAI approach in imaging internal muscle activities from multi-channel surface EMG recordings.
Keywords :
biomedical ultrasonics; electromyography; image denoising; medical image processing; muscle; MAI approach; biceps; bipolar channel; internal muscle activity imaging; intramuscular EMG signals; multichannel surface EMG recording; noise filtering; signal decomposition; simultaneous intramuscular EMG measurement; surface EMG measurements; ultrasound images; ultrasound scans; unipolar channels; validation purpose; validation study; wire electrode location; Electrodes; Electromyography; Image reconstruction; Imaging; Muscles; Surface reconstruction; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944391
Filename :
6944391
Link To Document :
بازگشت