• DocumentCode
    1402052
  • Title

    Multilayer Broadside-Coupled Dispersive Delay Structures for Analog Signal Processing

  • Author

    Horii, Yasushi ; Gupta, Shulabh ; Nikfal, Babak ; Caloz, Christophe

  • Author_Institution
    Dept. of Inf., Kansai Univ., Suita, Japan
  • Volume
    22
  • Issue
    1
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A compact multilayer non-commensurate C-section dispersive delay structure (DDS) is proposed for analog signal processing (ASP) applications. In contrast to a previously reported C-section DDS, which was uniplanar and used edge-coupled C-sections, this DDS is based on broadside-coupled C-sections, and hence achieves a much larger ratio of group delay swing to frequency bandwidth, leading to higher ASP resolution. Moreover, it is much more compact, while maintaining acceptable insertion loss. After a parametric characterization of a mono-block commensurate multilayer DDS, with varied strip widths, two multiblock non-commensurate DDSs with linear group delay slopes are demonstrated by full-wave simulation and experimental low-temperature co-fired ceramics results. The proposed DDS exhibits a significant footprint reduction factor of around 7 compared to its uniplanar edge-coupled counterpart.
  • Keywords
    analogue processing circuits; microwave circuits; ASP application; C-section DDS; analog signal processing; broadside-coupled C-section; compact multilayer noncommensurate C-section dispersive delay structure; edge-coupled C-section; footprint reduction factor; frequency bandwidth; full-wave simulation; group delay swing; linear group delay slope; multiblock noncommensurate DDS; multilayer broadside-coupled dispersive delay structure; strip width; Delay; Dispersion; Nonhomogeneous media; Strips; Wideband; All-pass networks; analog signal processing (ASP); dispersion engineering; dispersive delay structures (DDSs); group delay engineering; low-temperature co-fired ceramics (LTCC) technology;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2011.2176476
  • Filename
    6107590