DocumentCode :
1402192
Title :
Multi-Zone Thermal Processing in Semiconductor Manufacturing: Bias Estimation
Author :
Yan, Han ; Ho, Weng Khuen ; Ling, Keck Voon ; Lim, Khiang Wee
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
Volume :
6
Issue :
2
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
216
Lastpage :
228
Abstract :
Temperature uniformities within a wafer and from wafer to wafer have significant impact on the smallest feature size or critical dimension of integrated circuits. These are important issues with stringent specifications. To obtain temperature uniformity, a wafer is heated by multiple independently controlled heating elements simultaneously. The accuracy of temperature sensing is hence an important issue. In this paper, sensor bias is estimated for the difficult problem where measurement outliers are close to good data such that they cannot be separated easily. Equations are derived to predict the variance of the estimates from sample size. This information enables the selection of an efficient estimator. Sensor bias estimation efficiency translates into earlier bias removal and less faulty wafers. The theory is verified experimentally in a multi-zone thermal system for semiconductor wafer processing.
Keywords :
integrated circuit manufacture; integrated circuits; semiconductor technology; temperature sensors; bias estimation; integrated circuits; multizone thermal processing; semiconductor manufacturing; semiconductor wafer processing; sensor bias; temperature sensing; Multi-zone; robust bias estimator; semiconductor manufacturing; sensor bias;
fLanguage :
English
Journal_Title :
Industrial Informatics, IEEE Transactions on
Publisher :
ieee
ISSN :
1551-3203
Type :
jour
DOI :
10.1109/TII.2010.2040285
Filename :
5405070
Link To Document :
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