DocumentCode
1402606
Title
Guest Editorial
Author
Tripathi, V.K. ; Sturdivant, R.
Volume
45
Issue
10
fYear
1997
Firstpage
1817
Lastpage
1818
Keywords
Aerospace electronics; Electromagnetic modeling; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Microwave communication; Radio frequency; Radiofrequency integrated circuits; Space technology;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.1997.641779
Filename
641779
Link To Document