Author :
Tripathi, V.K. ; Sturdivant, R.
Keywords :
Aerospace electronics; Electromagnetic modeling; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Microwave communication; Radio frequency; Radiofrequency integrated circuits; Space technology;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.1997.641779
