Modeling millimeter-wave IC behavior for flipped-chip mounting schemes

Author

Jackson, Roxbert W. ; Ito, Ryosuke

Author_Institution

Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

Volume

45

Issue

10

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

1919

Lastpage

1925

Abstract

A circuit topology is presented for modeling flipped-chip-mounted monolithic microwave integrated circuits (MMIC´s) at microwave frequencies. The proposed topology especially models the loss of isolation due to the flipped-chip structure. Both coplanar and microstrip flipped chips are circuit modeled and their results compared to full numerical simulations and to scale-model measurements. Both measurements and numerical modeling show resonances in the millimeter-wave range

Keywords

MIMIC; MMIC; coplanar waveguides; equivalent circuits; flip-chip devices; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microstrip circuits; resonance; EHF; MIMIC; MM-wave IC behavior modelling; circuit topology; coplanar flipped chips; flip-chip MMIC; flipped-chip mounting schemes; isolation loss; microstrip flipped chips; microwave frequencies; millimeter-wave ICs; millimeter-wave range; monolithic microwave integrated circuits; resonances; Circuit topology; Integrated circuit measurements; Integrated circuit modeling; MMICs; Microwave frequencies; Microwave integrated circuits; Millimeter wave integrated circuits; Millimeter wave measurements; Monolithic integrated circuits; Semiconductor device measurement;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.641791

Filename

641791