Development of microwave package models utilizing on-wafer characterization techniques

Author

Chun, Carl ; Pham, Anh-Vu ; Laskar, Joy ; Hutchison, Brian

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

45

Issue

10

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

1948

Lastpage

1954

Abstract

A package characterization technique using coplanar waveguide (CPW) probes and line-reflect-match (LRM) calibrations for surface-mountable packages is presented. CPW-to-package adapters (CPA) are fabricated on alumina substrates to mount and measure the high-frequency response of plastic packages. Offset CPA standards in conjunction with an LRM calibration are used to de-embed the response of the adapters from the measured S-parameters. Application of this method is demonstrated by characterizing and modeling surface-mount microwave plastic packages

Keywords

MMIC; S-parameters; calibration; integrated circuit packaging; microwave measurement; plastic packaging; surface mount technology; Al₂O₃; CPW-to-package adapter; S-parameters; alumina substrate; coplanar waveguide probe; high-frequency response; line-reflect-match calibration; microwave package model; offset CPA standard; on-wafer measurement; surface-mount plastic package; Calibration; Coplanar waveguides; Electronics packaging; Frequency measurement; Integrated circuit measurements; Integrated circuit packaging; Microwave theory and techniques; Plastic packaging; Predictive models; Probes;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.641800

Filename

641800