DocumentCode :
140276
Title :
Multichannel wireless ECoG array ASIC devices
Author :
DeMichele, Glenn A. ; Cogan, Stuart F. ; Troyk, Philip R. ; Hongnan Chen ; Zhe Hu
Author_Institution :
Sigenics Inc., Chicago, IL, USA
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
3969
Lastpage :
3972
Abstract :
Surgical resection of epileptogenic foci is often a beneficial treatment for patients suffering debilitating seizures arising from intractable epilepsy [1], [2], [3]. Electrodes placed subdurally on the surface of the brain in the form of an ECoG array is one of the multiple methods for localizing epileptogenic zones for the purpose of defining the region for surgical resection. Currently, transcutaneous wires from ECoG grids limit the duration of time that implanted grids can be used for diagnosis. A wireless ECoG recording and stimulation system may be a solution to extend the diagnostic period. To avoid the transcutaneous connections, a 64-channel wireless silicon recording/stimulating ASIC was developed as the electronic component of a wireless ECoG array that uses SIROF electrodes on a polyimide substrate[4]. Here we describe two new ASIC devices that have been developed and tested as part of the on-going wireless ECoG system design.
Keywords :
application specific integrated circuits; biomedical electrodes; brain; medical disorders; surgery; wireless sensor networks; ASIC devices; SIROF electrodes; brain surface; debilitating seizures; diagnostic period; epileptogenic foci; epileptogenic zones; implanted grids; intractable epilepsy; multichannel wireless ECoG array; patient treatment; polyimide substrate; stimulation system; surgical resection; transcutaneous connections; transcutaneous wires; wireless ECoG recording; wireless silicon recording/stimulating ASIC; Application specific integrated circuits; Arrays; Electrodes; Epilepsy; Noise; Surgery; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944493
Filename :
6944493
Link To Document :
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