DocumentCode :
1403313
Title :
The first IA-64 microprocessor
Author :
Rusu, Stefan ; Singer, Gadi
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Volume :
35
Issue :
11
fYear :
2000
Firstpage :
1539
Lastpage :
1544
Abstract :
The first implementation of the IA-64 architecture achieves high performance by using a highly parallel execution core, while maintaining binary compatibility with the IA-32 instruction set. Explicitly parallel instruction computing (EPIC) design maximizes performance through hardware and software synergy. The processor contains 25.4 million transistors and operates at 800 MHz. The chip is fabricated in a 0.18-/spl mu/m CMOS process with six metal layers and packaged in a 1012-pad organic land grid array using C4 (flip chip) assembly technology. A core speed back-side bus connects the processor to a 4-MB L3 cache.
Keywords :
CMOS digital integrated circuits; design for testability; integrated circuit design; integrated circuit packaging; microprocessor chips; parallel architectures; 0.18 mum; 1012-pad organic land grid array; 64 bit; 800 MHz; C4 flip chip assembly technology; CMOS process; DFT; IA-32 instruction set; IA-64 architecture; IA-64 microprocessor; L3 cache; OTB domino circuits; binary compatibility; clock distribution methodology; core speed back-side bus; distributed deskew buffers; explicitly parallel instruction computing design; hardware/software synergy; highly parallel execution core; Assembly; CMOS process; Computer aided instruction; Computer architecture; Concurrent computing; Flip chip; Hardware; Microprocessors; Packaging; Software performance;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/4.881197
Filename :
881197
Link To Document :
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