DocumentCode :
1404844
Title :
Modeling and simulation of stress-induced leakage current in ultrathin SiO2 films
Author :
Riccò, Bruno ; Gozzi, Gianfranco ; Lanzoni, Massimo
Author_Institution :
Dipt. di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
Volume :
45
Issue :
7
fYear :
1998
fDate :
7/1/1998 12:00:00 AM
Firstpage :
1554
Lastpage :
1560
Abstract :
This paper presents a new model fur stress-induced leakage current (SILC) in ultrathin SiO2 films, that is able to explain and accurately represent the experimental data obtained with MOS capacitors fabricated with different technologies and oxide thickness in the 3-7 nm range
Keywords :
MOS capacitors; insulating thin films; leakage currents; silicon compounds; 3 to 7 nm; MOS capacitor; SILC; SiO2; modeling; simulation; stress induced leakage current; ultrathin SiO2 film; Conductive films; Conductivity; Electrons; Leakage current; MOS capacitors; Nonvolatile memory; Stress; Substrates; Tunneling; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.701488
Filename :
701488
Link To Document :
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