• DocumentCode
    140626
  • Title

    Exploring regulatory elements in low-methylated regions for gene expression prediction

  • Author

    Hong Hu ; Yang Dai

  • Author_Institution
    Dept. of Bioeng., Univ. of Illinois at Chicago, Chicago, IL, USA
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    4763
  • Lastpage
    4766
  • Abstract
    Recent studies on methylomes have indicated that low-methylated regions (LMRs) are related to potential active distal regulatory regions. To further investigate the potential relation between LMRs and gene expression regulation, we propose a penalized logistic regression model to predict gene expression directional change based on computationally analyzed transcription factor binding sites in LMRs that are distinctive between two cell types. We evaluated this approach using the whole genome bisulphite sequencing and RNA-seq data of two cell types: adipose-derived stem cells and iPSCs of adipose-derived stem cells. For Differentially Expressed (DE) genes with LMRs in their intergenic and/or genebody regions, our model obtained a 10-fold cross-validated AUC value of 0.88 for prediction of expression directional change. For DE genes with only LMRs in intergenic regions the corresponding AUC value is 0.84.
  • Keywords
    RNA; cellular biophysics; genetics; genomics; regression analysis; RNA-seq data; active distal regulatory regions; adipose-derived stem cells; computationally analyzed transcription factor binding sites; differentially expressed genes; gene expression directional change prediction; genebody regions; iPSC; intergenic regions; low-methylated regions; methylomes; penalized logistic regression model; ten-fold cross-validated AUC value; whole genome bisulphite sequencing; Bioinformatics; DNA; Gene expression; Genomics; Logistics; Predictive models; Pulse width modulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6944689
  • Filename
    6944689