• DocumentCode
    1406463
  • Title

    Fabrication of semiconductor optical switch module using laser welding technique

  • Author

    Kang, Seung-Goo ; Song, Min-Kyu ; Park, Seong-Su ; Lee, Sang-Hwan ; Hwang, Nam ; Lee, Hee-Tae ; Oh, Kwang-Ryong ; Joo, Gwan-Chong ; Lee, Donghan

  • Author_Institution
    XL Photonics Inc., Taejon, South Korea
  • Volume
    23
  • Issue
    4
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    672
  • Lastpage
    680
  • Abstract
    The 4×4, 1×2, and 1×4 semiconductor optic-switch modules for 1550 nm optical communication systems were fabricated by using the laser welding technique based on the 30-pin butterfly package. For better coupling efficiency between a switch chip and an optical fiber, tapered fibers of 10-15 μm lens radius were used to provide the coupling efficiency up to 60%. The lens to lens distance of the assembled tapered fiber array was controlled within ±1.0 μm. A laser hammering technique was introduced to adjust the radial shift, which was critical to obtain comparable optical coupling efficiencies from all the channels at the same time. The fabricated optical switch modules showed good thermal stability, with less than 5% degradation after a 200 thermal cycling. The transmission characteristics of the 4×4 switch module showed good sensitivities, providing error free transmissions below -30 dBm for all the switching paths. The dynamic ranges for the 4×4 and 1×2 switch modules were about 8 dB for a 3 dB penalty and about 17 dB for a 2 dB penalty, respectively.
  • Keywords
    integrated optics; laser beam welding; modules; optical communication equipment; optical switches; semiconductor device packaging; semiconductor laser arrays; semiconductor optical amplifiers; semiconductor switches; thermal stability; 1550 nm; alignment scheme; array packaging; butterfly package; controlled lens to lens distance; coupling efficiency; dynamic range; error free transmissions; laser hammering technique; laser welding technique; multichannel optical device; optical communication systems; semiconductor optical switch module; switch fabrication; tapered fibers; thermal stability; transmission characteristics; Fiber lasers; Lenses; Optical coupling; Optical device fabrication; Optical fiber communication; Optical fibers; Optical sensors; Optical switches; Semiconductor lasers; Welding;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.883757
  • Filename
    883757