DocumentCode
140657
Title
Detection of diabetic foot hyperthermia by infrared imaging
Author
Vilcahuaman, L. ; Harba, R. ; Canals, R. ; Zequera, M. ; Wilches, C. ; Arista, M.T. ; Torres, L. ; Arbañil, H.
Author_Institution
Pontifical Catholic Univ. of Peru PUCP, Lima, Peru
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
4831
Lastpage
4834
Abstract
In diabetic foot, the occurrence of an ulcer is often associated with hyperthermia. Hyperthermia is defined as a temperature greater than 2.2oC in a given region of one of the foot compared to the temperature of the same region of the contralateral foot. Unfortunately, hyperthermia is not yet assessed in current diabetic foot therapy. In this paper, we propose an easy way to detect a possible hyperthermia by using an infrared camera. A specific acquisition protocol of the thermal images is proposed. A dedicated image analysis is developed: it is composed of a contour detection of the 2 feet using the Chan and Vese active contour method associated to the ICP rigid registration technique. Among 85 type II diabetes persons recruited in the Dos de Mayo hospital in Lima, Peru, 9 individuals show significant hyperthermia. It is expected that the new possibility of detecting hyperthermia in hospitals or in diabetic health centers which is now available, thanks to the proposed method, will help in reducing foot ulcer occurrence for diabetic persons.
Keywords
biomedical optical imaging; cameras; diseases; hyperthermia; image registration; infrared imaging; medical image processing; Chan active contour method; ICP rigid registration technique; Vese active contour method; acquisition protocol; contour detection; diabetic foot hyperthermia detection; diabetic health centers; foot ulcer; image analysis; infrared camera; infrared imaging; thermal images; type II diabetes; Biomedical imaging; Cameras; Diabetes; Foot; Hospitals; Hyperthermia; Monitoring;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6944705
Filename
6944705
Link To Document