Title :
3D integration technology for lab-on-a-chip applications
Author :
Temiz, Yuksel ; Kilchenmann, S. ; Leblebici, Yusuf ; Guiducci, C.
Author_Institution :
Lab. of Life Sci. Electron. (CLSE), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
Abstract :
A review is presented of advances and challenges in fully integrated systems for personalised medicine applications. One key issue for the commercialisation of such systems is the disposability of the assay-substrate at a low cost. This work adds a new dimension to the integrated circuits technology for lab-on-a-chip systems by employing 3D integration for improved performance and functionality. It is proposed that a disposable biosensing layer can be aligned and temporarily attached to the 3D CMOS stack by the vertical interconnections, and can be replaced after each measurement.
Keywords :
biomedical electronics; integrated circuit interconnections; lab-on-a-chip; 3D CMOS stack; 3D integration technology; assay-substrate; commercialisation; disposability; disposable biosensing layer; fully integrated systems; integrated circuits technology; lab-on-a-chip applications; personalised medicine applications; vertical interconnections;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2011.2683
