DocumentCode
1407014
Title
Physics-Based Thermal Conductivity Model for Metallic Single-Walled Carbon Nanotube Interconnects
Author
Bhattacharya, Sitangshu ; Amalraj, Rex ; Mahapatra, Santanu
Author_Institution
Nano-Scale Device Res. Lab., Indian Inst. of Sci., Bangalore, India
Volume
32
Issue
2
fYear
2011
Firstpage
203
Lastpage
205
Abstract
In this letter, a closed-form analytical model for temperature-dependent longitudinal diffusive lattice thermal conductivity (κ) of a metallic single-walled carbon nanotube (SWCNT) has been addressed. Based on the Debye theory, the second-order three-phonon Umklapp, mass difference (MD), and boundary scatterings have been incorporated to formulate κ in both low- and high-temperature regimes. It is proposed that κ at low temperature (T) follows the T3 law and is independent of the second-order three-phonon Umklapp and MD scatterings. The form factor due to MD scattering also plays a key role in the significant variation of κ in addition to the SWCNT length. The present diameter-independent model of κ agrees well with the available experimental data on suspended intrinsic metallic SWCNTs over a wide range of temperature and can be carried forward for electrothermal analyses of CNT-based interconnects.
Keywords
carbon nanotubes; integrated circuit interconnections; thermal conductivity; CNT based interconnects; Debye theory; MD scatterings; Umklapp; boundary scatterings; closed-form analytical model; mass difference; metallic single-walled carbon nanotube interconnects; physics based thermal conductivity model; second-order three-phonon; temperature-dependent longitudinal diffusive lattice thermal conductivity; Interconnects; nanotubes; phonons; thermal conductivity;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2010.2091491
Filename
5671466
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