Focal-plane-arrays and CMOS readout techniques of infrared imaging systems

Author

Hsieh, Chih-Cheng ; Wu, Chung-Yu ; Jih, Far-Wen ; Sun, Tai-Ping

Author_Institution

Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

Volume

7

Issue

4

fYear

1997

fDate

8/1/1997 12:00:00 AM

Firstpage

594

Lastpage

605

Abstract

A discussion of CMOS readout technologies for infrared (IR) imaging systems is presented. First, the description of various types of IR detector materials and structures is given. The advances of detector fabrication technology and microelectronics process technology have led to the development of large format array of IR imaging detectors. For such large IR FPAs which is the critical component of the advanced infrared imaging system, general requirement and specifications are described. To support a good interface between the FPA and downstream signal processing stage, both conventional and CMOS readout techniques are presented and discussed. Finally, future development directions including the smart focal plane concept are also introduced

Keywords

CMOS digital integrated circuits; CMOS integrated circuits; VLSI; digital signal processing chips; focal planes; image processing; infrared imaging; CMOS readout techniques; IR detector materials; IR detector structures; IR imaging detectors; IR imaging systems; detector fabrication technology; downstream signal processing stage; focal plane arrays; infrared imaging systems; large format array; microelectronics process technology; smart focal plane concept; CMOS image sensors; CMOS technology; Infrared detectors; Infrared imaging; Optical imaging; Photonic band gap; Readout electronics; Sensor arrays; Sun; Very large scale integration;

fLanguage

English

Journal_Title

Circuits and Systems for Video Technology, IEEE Transactions on

Publisher

ieee

ISSN

1051-8215

Type

jour

DOI

10.1109/76.611171

Filename

611171