Title :
The impact of head movements on EEG and contact impedance: An adaptive filtering solution for motion artifact reduction
Author :
Mihajlovic, Vojkan ; Patki, Shrishail ; Grundlehner, Bernard
Author_Institution :
Holst Centre, imec The Netherlands, Eindhoven, Netherlands
Abstract :
Designing and developing a comfortable and convenient EEG system for daily usage that can provide reliable and robust EEG signal, encompasses a number of challenges. Among them, the most ambitious is the reduction of artifacts due to body movements. This paper studies the effect of head movement artifacts on the EEG signal and on the dry electrode-tissue impedance (ETI), monitored continuously using the imec´s wireless EEG headset. We have shown that motion artifacts have huge impact on the EEG spectral content in the frequency range lower than 20Hz. Coherence and spectral analysis revealed that ETI is not capable of describing disturbances at very low frequencies (below 2Hz). Therefore, we devised a motion artifact reduction (MAR) method that uses a combination of a band-pass filtering and multi-channel adaptive filtering (AF), suitable for real-time MAR. This method was capable of substantially reducing artifacts produced by head movements.
Keywords :
adaptive filters; band-pass filters; biological tissues; biomechanics; biomedical electrodes; electroencephalography; medical signal processing; signal denoising; spectral analysis; AF; EEG signal; EEG spectral content; ETI; adaptive filtering solution; band-pass filtering; body movements; coherence analysis; comfortable EEG system; contact impedance; convenient EEG system; daily usage; dry electrode-tissue impedance; head movement artifacts; imec´s wireless EEG headset; motion artifact reduction method; multichannel adaptive filtering; real-time MAR; spectral analysis; Band-pass filters; Coherence; Electrodes; Electroencephalography; Impedance; Motion segmentation; Skin;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
DOI :
10.1109/EMBC.2014.6944763