DocumentCode
1407455
Title
Stacked gate mid-channel injection flash EEPROM cell-Part II: analysis of gate current and modeling of programming characteristics
Author
Kim, Dae M. ; Cho, M.K. ; Kwon, W.H.
Author_Institution
Dept. of Electr. Eng., Pohang Univ. of Sci. & Technol., South Korea
Volume
45
Issue
8
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
1703
Lastpage
1709
Abstract
The programming characteristics of the stacked gate mid-channel injection (SMCI) flash memory cell is quantitatively analyzed vis a vis the stacked gate device. In the present model, the hot electrons in the high field channel region are described by the elevated temperature model. The programming speed and efficiency depend, among other factors, on the carrier lifetime, which is limited by both the recombination process and the carrier dwell time in the channel. The gate currents from the reference devices are quantitatively analyzed and specified empirically via the applied voltages and the device parameters. These results are applied to modeling the shift in time of the threshold voltage and the simulated values are shown to fit the data with a fair degree of accuracy
Keywords
EPROM; carrier lifetime; electron-hole recombination; hot carriers; integrated circuit modelling; integrated memory circuits; carrier dwell time; carrier lifetime; efficiency; elevated temperature model; gate current; high field; hot electrons; programming speed; recombination; stacked gate mid-channel injection flash EEPROM cell; threshold voltage; Charge carrier lifetime; EPROM; Electron emission; Flash memory cells; Hot carriers; Impact ionization; Spontaneous emission; Substrates; Temperature; Threshold voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.704368
Filename
704368
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