• DocumentCode
    1407455
  • Title

    Stacked gate mid-channel injection flash EEPROM cell-Part II: analysis of gate current and modeling of programming characteristics

  • Author

    Kim, Dae M. ; Cho, M.K. ; Kwon, W.H.

  • Author_Institution
    Dept. of Electr. Eng., Pohang Univ. of Sci. & Technol., South Korea
  • Volume
    45
  • Issue
    8
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    1703
  • Lastpage
    1709
  • Abstract
    The programming characteristics of the stacked gate mid-channel injection (SMCI) flash memory cell is quantitatively analyzed vis a vis the stacked gate device. In the present model, the hot electrons in the high field channel region are described by the elevated temperature model. The programming speed and efficiency depend, among other factors, on the carrier lifetime, which is limited by both the recombination process and the carrier dwell time in the channel. The gate currents from the reference devices are quantitatively analyzed and specified empirically via the applied voltages and the device parameters. These results are applied to modeling the shift in time of the threshold voltage and the simulated values are shown to fit the data with a fair degree of accuracy
  • Keywords
    EPROM; carrier lifetime; electron-hole recombination; hot carriers; integrated circuit modelling; integrated memory circuits; carrier dwell time; carrier lifetime; efficiency; elevated temperature model; gate current; high field; hot electrons; programming speed; recombination; stacked gate mid-channel injection flash EEPROM cell; threshold voltage; Charge carrier lifetime; EPROM; Electron emission; Flash memory cells; Hot carriers; Impact ionization; Spontaneous emission; Substrates; Temperature; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.704368
  • Filename
    704368