DocumentCode :
140813
Title :
Miniaturized tool for optogenetics based on an LED and an optical fiber interfaced by a silicon housing
Author :
Schwaerzle, M. ; Elmlinger, P. ; Paul, O. ; Ruther, P.
Author_Institution :
Dept. of Microsyst. Eng. (IMTEK), Albert-Ludwigs-Univ. of Freiburg, Freiburg, Germany
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
5252
Lastpage :
5255
Abstract :
This paper reports on the design, simulation, fabrication and characterization of a tool for optogenetic experiments based on a light emitting diode (LED). A minimized silicon (Si) interface houses the LED and aligns it to an optical fiber. With a Si housing size of 550×500×380 μm3 and an electrical interconnection of the LED by a highly flexible polyimide (PI) ribbon cable is the system very variable. PI cables and Si housings are fabricated using established microsystem technologies. A 270×220×50 μm3 bare LED chip is flip-chip-bonded onto the PI cable. The Si housing is adhesively attached to the PI cable, thereby hosting the LED in a recess. An opposite recess guides the optical fiber with a diameter of 125 μm. An aperture in-between restricts the emitted LED light to the fiber core. The optical fiber is adhesively fixed into the Si housing recess. An optical output intensity at the fiber end facet of 1.71 mW/mm2 was achieved at a duty cycle of 10 % and a driving current of 30 mA.
Keywords :
elemental semiconductors; flip-chip devices; light emitting diodes; micromechanical devices; optical fibre cladding; optical interconnections; silicon; LED chip; PI cable; Si; current 30 mA; electrical interconnection; fiber core; flexible polyimide ribbon cable; flip-chip; light emitting diode; microsystem technology; optical fiber; optogenetics; silicon housing; silicon interface; size 125 mum; Apertures; Assembly; Light emitting diodes; Optical fiber cables; Optical fibers; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944810
Filename :
6944810
Link To Document :
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