DocumentCode :
1408868
Title :
Dynamic analysis of V transmission lines
Author :
Ramahi, Omar M. ; Elsherbeni, Atef Z. ; Smith, Charles E.
Author_Institution :
Digital Equipment Corp., Maynard, MA, USA
Volume :
21
Issue :
3
fYear :
1998
fDate :
8/1/1998 12:00:00 AM
Firstpage :
250
Lastpage :
257
Abstract :
In this work, a dynamic analysis of the V line is presented. Previous work analyzed the performance of this structure for low frequency applications using quasistatic approximations. Here, we extend the analysis of the V line into the higher frequency range where dispersion becomes significant and where it cannot be predicted by quasistatic methods. We show that the V line provides features and advantages that are not present in the conventional microstrip structures, most notably the appreciable decrease in coupling between adjacent lines in comparison with the conventional microstrip structure. This feature makes the V line well suited for high packaging density applications. The full-wave analysis is carried out using a Yee-cell based finite-difference time-domain (FDTD) method, while enforcing a highly efficient and stable mesh truncation technique. Results are presented for a single and multiconductor structures
Keywords :
finite difference time-domain analysis; transmission line theory; FDTD method; V transmission line; Yee cell; coupling; dispersion; dynamic analysis; full-wave analysis; mesh truncation; multiconductor structure; numerical model; packaging density; single conductor structure; Conducting materials; Dielectric substrates; Dispersion; Finite difference methods; Frequency; Microstrip; Packaging; Performance analysis; Time domain analysis; Transmission lines;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.704935
Filename :
704935
Link To Document :
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