Characterization of embedded passives using macromodels in LTCC technology

Author

Choi, Kwang Lim ; Na, Nanju ; Swaminathan, Madhavan

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

21

Issue

3

fYear

1998

fDate

8/1/1998 12:00:00 AM

Firstpage

258

Lastpage

268

Abstract

This paper discusses the frequency and time domain response of embedded passive components in a multilayered structure fabricated using low temperature co-fired ceramic (LTCC) technology. A rational polynomial approximation that combines the accuracy of EM solvers with interpolation methods has been used to capture the frequency dependent losses and parasitics of embedded passives in a macro-model. This method allows for a significant speed-up in computation time while using commercial EM solvers. The macromodel with suitable modification has been used to compute the time domain response in SPICE for typical embedded passive structures. Simulation results show good correlation with time domain reflectometry/time-domain-transmission (TDR/TDT) measurements. The behavior of embedded passives in the high frequency operation of transmission lines and voltage divider networks has also been discussed

Keywords

SPICE; ceramics; interpolation; packaging; polynomials; EM solver; LTCC technology; SPICE simulation; embedded passive component; frequency domain response; interpolation; losses; low temperature co-fired ceramic; macromodel; multilayered packaging; parasitics; rational polynomial approximation; time domain response; transmission line; voltage divider network; Ceramics; Computational modeling; Embedded computing; Frequency dependence; Interpolation; Polynomials; Reflectometry; SPICE; Temperature; Transmission line measurements;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.704936

Filename

704936