Title :
Figures-of-merit for package electrical roadmaps
Author_Institution :
Somerset Design Center, Motorola Inc., Austin, TX, USA
fDate :
8/1/1998 12:00:00 AM
Abstract :
Transient currents created by on-chip switching in cores and by off-chip drivers cause noise to be generated on package parasitics. Simple mathematical models for the noise are used to derive figures-of-merit for the two cases of on-chip and off-chip switching. SIA Roadmap packaging trends are used with the figures-of-merit to produce package noise trends
Keywords :
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; transients; SIA Roadmap packaging trends; mathematical noise models; off-chip driver; on-chip switching; package electrical roadmaps; package noise trends; package parasitics; transient currents; Circuit noise; Circuit simulation; Clocks; Electronics packaging; Equivalent circuits; Laplace equations; Microprocessors; Noise figure; Physics; Power system modeling;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
