DocumentCode
1408914
Title
Design methodology for chip-on-chip applications
Author
Low, Yee L. ; Frye, Robert C. ; O´Connor, Kevin J.
Author_Institution
Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
Volume
21
Issue
3
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
298
Lastpage
301
Abstract
Chip-on-chip is a viable alternative solution for some applications requiring logic and memory integration. However, one of the impediments to this technology is lack of design infrastructure. Conventional multichip design methodologies which are extensions of standard board designs are not well-suited to chip-on-chip designs. To address this issue, we have implemented a chip-on-chip design methodology that incorporates both logic and memory design database and utilizes an auto-router to minimize routing layers. It emulates a two-layer routing system by using a single redistribution metal layer on each chip and solder bumps as vias. In this paper, we describe several chip-on-chip modules designed using this methodology and discuss the method´s limitations
Keywords
integrated circuit design; integrated circuit packaging; network routing; IC packaging; auto-router; chip-on-chip applications; design infrastructure; logic design; memory design; routing layers; single redistribution metal layer; solder bumps; two-layer routing system; Costs; Design methodology; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic circuits; Logic devices; Microprocessors; Routing; Testing;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.704941
Filename
704941
Link To Document