• DocumentCode
    1408914
  • Title

    Design methodology for chip-on-chip applications

  • Author

    Low, Yee L. ; Frye, Robert C. ; O´Connor, Kevin J.

  • Author_Institution
    Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
  • Volume
    21
  • Issue
    3
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    298
  • Lastpage
    301
  • Abstract
    Chip-on-chip is a viable alternative solution for some applications requiring logic and memory integration. However, one of the impediments to this technology is lack of design infrastructure. Conventional multichip design methodologies which are extensions of standard board designs are not well-suited to chip-on-chip designs. To address this issue, we have implemented a chip-on-chip design methodology that incorporates both logic and memory design database and utilizes an auto-router to minimize routing layers. It emulates a two-layer routing system by using a single redistribution metal layer on each chip and solder bumps as vias. In this paper, we describe several chip-on-chip modules designed using this methodology and discuss the method´s limitations
  • Keywords
    integrated circuit design; integrated circuit packaging; network routing; IC packaging; auto-router; chip-on-chip applications; design infrastructure; logic design; memory design; routing layers; single redistribution metal layer; solder bumps; two-layer routing system; Costs; Design methodology; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic circuits; Logic devices; Microprocessors; Routing; Testing;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.704941
  • Filename
    704941