Integration of a Monolithic Buck Converter Power IC and Bondwire Inductors With Ferrite Epoxy Glob Cores

Author

Jia, Hongwei ; Lu, Jian ; Wang, Xuexin ; Padmanabhan, Karthik ; Shen, Z. John

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA

Volume

26

Issue

6

fYear

2011

fDate

6/1/2011 12:00:00 AM

Firstpage

1627

Lastpage

1630

Abstract

In this letter, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC containing all switching devices, driver circuitry, and control logic was designed and fabricated with a standard 0.5-μm CMOS process. Mutliturn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A prototype system-in-package converter with an output voltage and current of 2.5 V and 120 mA was built to operate at frequencies up to 5 MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.

Keywords

CMOS analogue integrated circuits; driver circuits; power convertors; power inductors; power integrated circuits; system-in-package; system-on-chip; CMOS process; active power switch; bondwire inductor; control logic; current 120 mA; driver circuitry; ferrite epoxy Glob core; filter inductor; in-package bondwire inductor; monolithic buck converter power IC; mutliturn bondwire; prototype system-in-package converter; size 0.5 mum; switching device; voltage 2.5 V; Converters; Ferrites; Inductance; Inductors; Integrated circuits; Magnetic cores; Bondwire magnetics; buck converter; integrated inductor; power-supply-in-a-package (PSiP); power-supply-on-a-chip (PSoC);

fLanguage

English

Journal_Title

Power Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0885-8993

Type

jour

DOI

10.1109/TPEL.2010.2100829

Filename

5672608