DocumentCode
1409141
Title
Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient Between Fused Silica and Metallic Materials
Author
Li, Xuefeng ; Lin, Shuo ; Liang, Jinxing ; Zhang, Yupeng ; Oigawa, Hiroshi ; Ueda, Toshitsugu
Author_Institution
Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu, Japan
Volume
4
Issue
1
fYear
2012
Firstpage
155
Lastpage
162
Abstract
In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm/°C in a wide range from -79°C to +70°C. And the coefficient of determination R2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.
Keywords
Fabry-Perot interferometers; electroplating; fibre optic sensors; focused ion beam technology; gold; metallic thin films; microcavities; micromachining; milling; nickel; silicon compounds; sputter deposition; temperature sensors; thermal expansion; SiO2-Au; SiO2-Ni; electroplating; fiber-optic Fabry-Perot interferometric temperature sensor; focused ion beam milling; fused silica; gold film; metallic cylinder; metallic materials; micromachined microcavity; nickel film; single-mode fiber; sputtering; temperature -70 degC to 70 degC; thermal expansion coefficient; Cavity resonators; Optical fiber sensors; Optical fibers; Silicon compounds; Temperature measurement; Temperature sensors; Thermal expansion; Fabry–Perot interferometric (FFPI); fiber sensor; focused ion beam milling; thermal expansion coefficient;
fLanguage
English
Journal_Title
Photonics Journal, IEEE
Publisher
ieee
ISSN
1943-0655
Type
jour
DOI
10.1109/JPHOT.2011.2181943
Filename
6112705
Link To Document