DocumentCode :
1409267
Title :
Random Work-Function-Induced Threshold Voltage Fluctuation in Metal-Gate MOS Devices by Monte Carlo Simulation
Author :
Li, Yiming ; Cheng, Hui-Wen
Author_Institution :
Dept. of Electr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
25
Issue :
2
fYear :
2012
fDate :
5/1/2012 12:00:00 AM
Firstpage :
266
Lastpage :
271
Abstract :
In this paper, we estimate the effect of random work function (WK) on the threshold voltage fluctuation (σVth) of 16-nm-gate metal-oxide-semiconductor field-effect transistors (MOSFETs) with metal-gate materials. To examine the random WK induced σVth, nanosized metal grains with different gate materials are considered in a large-scale statistical simulation. An analytical expression of the WK induced σVth is proposed based on the Monte Carlo simulation results which can outlook different extents of fluctuation resulting from various metal gates and benefit the device fabrication. Devices with a two-layer metal-gate are further studied for fluctuation suppression; the finding of this paper indicates the first layer of the gate structure plays the most significant role in the suppression of the WK induced σVth, compared with the second layer. This paper provides an insight into random work-function-induced threshold voltage fluctuation, which can, in turn, be used to assess metal gate characteristics of MOSFETs.
Keywords :
MOSFET; Monte Carlo methods; MOSFET; Monte Carlo simulation; device fabrication; fluctuation suppression; metal-gate MOS device; metal-gate material; metal-oxide-semiconductor field-effect transistor; nanosized metal grain; random work-function-induced threshold voltage fluctuation; size 16 nm; statistical simulation; Fluctuations; Grain size; Logic gates; Threshold voltage; Tin; Averaged work function; MOS devices; Monte Carlo; metal gate; threshold voltage fluctuation simulation; work function (WK);
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2011.2181964
Filename :
6112722
Link To Document :
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