• DocumentCode
    1409457
  • Title

    Modeling a die bonder with Petri nets: a case study

  • Author

    Janneck, Jörn W. ; Naedele, Martin

  • Author_Institution
    Comput. Eng. & Networks Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
  • Volume
    11
  • Issue
    3
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    404
  • Lastpage
    409
  • Abstract
    The process of designing complex manufacturing machines involves problems of interdisciplinary communication, design space exploration as well as design evaluation and analysis that can best be solved by integrating modeling and simulation stages into the development process. Requirements necessary for a modeling environment are: support for hierarchical and modular structuring, module reuse, configurability of the model, executability of the model with a notion of time, and intuitive usability. The CodeSign object-oriented, temporal Petri net formalism with its associated tool is a modeling and simulation environment to meet those requirements. A case study conducted in an industrial setting is described that demonstrates the applicability of the CodeSign approach to the modeling of semiconductor manufacturing equipment with step-wise refinement. Results are given to show the accuracy of simulation results with respect to data actually measured on the machine. The CodeSign simulation results are shown to have superior accuracy compared to the output of a previous spreadsheet model of the same machine
  • Keywords
    Petri nets; critical path analysis; integrated circuit manufacture; integrated circuit packaging; microassembling; object-oriented methods; production engineering computing; semiconductor device manufacture; CodeSign object-oriented temporal Petri net formalism; Gantt chart viewer; IC packaging; Petri nets; complex manufacturing machine design; configurability; die bonder modeling; executability; hierarchical structuring; intuitive usability; modular structuring; module reuse; semiconductor manufacturing equipment; simulation environment; step-wise refinement; Analytical models; Bonding; Manufacturing industries; Manufacturing processes; Object oriented modeling; Petri nets; Process design; Space exploration; Usability; Virtual manufacturing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.705375
  • Filename
    705375