DocumentCode
1409457
Title
Modeling a die bonder with Petri nets: a case study
Author
Janneck, Jörn W. ; Naedele, Martin
Author_Institution
Comput. Eng. & Networks Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
Volume
11
Issue
3
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
404
Lastpage
409
Abstract
The process of designing complex manufacturing machines involves problems of interdisciplinary communication, design space exploration as well as design evaluation and analysis that can best be solved by integrating modeling and simulation stages into the development process. Requirements necessary for a modeling environment are: support for hierarchical and modular structuring, module reuse, configurability of the model, executability of the model with a notion of time, and intuitive usability. The CodeSign object-oriented, temporal Petri net formalism with its associated tool is a modeling and simulation environment to meet those requirements. A case study conducted in an industrial setting is described that demonstrates the applicability of the CodeSign approach to the modeling of semiconductor manufacturing equipment with step-wise refinement. Results are given to show the accuracy of simulation results with respect to data actually measured on the machine. The CodeSign simulation results are shown to have superior accuracy compared to the output of a previous spreadsheet model of the same machine
Keywords
Petri nets; critical path analysis; integrated circuit manufacture; integrated circuit packaging; microassembling; object-oriented methods; production engineering computing; semiconductor device manufacture; CodeSign object-oriented temporal Petri net formalism; Gantt chart viewer; IC packaging; Petri nets; complex manufacturing machine design; configurability; die bonder modeling; executability; hierarchical structuring; intuitive usability; modular structuring; module reuse; semiconductor manufacturing equipment; simulation environment; step-wise refinement; Analytical models; Bonding; Manufacturing industries; Manufacturing processes; Object oriented modeling; Petri nets; Process design; Space exploration; Usability; Virtual manufacturing;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.705375
Filename
705375
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