DocumentCode
1409482
Title
Design and modeling of rapid thermal processing systems
Author
Stuber, John Douglas ; Trachtenberg, Isaac ; Edgar, Thomas F.
Volume
11
Issue
3
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
442
Lastpage
457
Abstract
The concept of rapid thermal processing (RTP) has many potential applications in microelectronics manufacturing, but the details of chamber design, temperature dynamics, process control, and temperature measurement remain active areas of research. This paper discusses the design rules used in an RTP test bed installed at SEMATECH with respect to the placement of lamps and the geometry and reflectivity of the enclosure. The distribution of light across the wafer was modeled, and a theory fur the wafer´s dynamic temperature response was derived analytically with a few simplifying assumptions, parameters for this model were estimated from experimental data to yield a set of linear ordinary differential equations with temperature dependent coefficients. This particular model form is convenient for control system design and analysis
Keywords
integrated circuit manufacture; process control; rapid thermal processing; temperature control; SEMATECH; chamber design; dynamic temperature response; geometry; linear ordinary differential equations; microelectronics manufacturing; process control; rapid thermal processing systems; reflectivity; temperature dependent coefficients; temperature dynamics; temperature measurement; Manufacturing processes; Microelectronics; Process control; Process design; Rapid thermal processing; Semiconductor device modeling; Temperature dependence; Temperature distribution; Temperature measurement; Testing;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.705379
Filename
705379
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