• DocumentCode
    1409482
  • Title

    Design and modeling of rapid thermal processing systems

  • Author

    Stuber, John Douglas ; Trachtenberg, Isaac ; Edgar, Thomas F.

  • Volume
    11
  • Issue
    3
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    442
  • Lastpage
    457
  • Abstract
    The concept of rapid thermal processing (RTP) has many potential applications in microelectronics manufacturing, but the details of chamber design, temperature dynamics, process control, and temperature measurement remain active areas of research. This paper discusses the design rules used in an RTP test bed installed at SEMATECH with respect to the placement of lamps and the geometry and reflectivity of the enclosure. The distribution of light across the wafer was modeled, and a theory fur the wafer´s dynamic temperature response was derived analytically with a few simplifying assumptions, parameters for this model were estimated from experimental data to yield a set of linear ordinary differential equations with temperature dependent coefficients. This particular model form is convenient for control system design and analysis
  • Keywords
    integrated circuit manufacture; process control; rapid thermal processing; temperature control; SEMATECH; chamber design; dynamic temperature response; geometry; linear ordinary differential equations; microelectronics manufacturing; process control; rapid thermal processing systems; reflectivity; temperature dependent coefficients; temperature dynamics; temperature measurement; Manufacturing processes; Microelectronics; Process control; Process design; Rapid thermal processing; Semiconductor device modeling; Temperature dependence; Temperature distribution; Temperature measurement; Testing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.705379
  • Filename
    705379