Title :
A Comparative Study of NBTI and RTN Amplitude Distributions in High-
Gate Dielectric pMOSFETs
Author :
Chiu, J.P. ; Chung, Y.T. ; Wang, Tahui ; Chen, Min-Cheng ; Lu, C.Y. ; Yu, K.F.
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
Random telegraph noise (RTN) and negative bias temperature (NBT) stress-induced threshold voltage (Vt) fluctuations in high-κ gate dielectric and metal-gate pMOSFETs are investigated. We measured RTN amplitude distributions before and after NBT stress. RTN in poststressed devices exhibits a broader amplitude distribution than the prestress one. In addition, we trace a single trapped charge-induced ΔVt in NBT stress and find that the average ΔVt is significantly larger than a ΔVt caused by RTN. A 3-D atomistic simulation is performed to compare a single-charge-induced ΔVt by RTN and NBTI. In our simulation, the probability distribution of a NBT trapped charge in the channel is calculated from the reaction-diffusion model. Our simulation confirms that the NBT-induced ΔVt indeed has a larger distribution tail than RTN due to a current-path percolation effect.
Keywords :
MOSFET; burst noise; dielectric devices; high-k dielectric thin films; percolation; reaction-diffusion systems; semiconductor device noise; statistical distributions; 3D atomistic simulation; NBT stress; NBT trapped charge; NBTI amplitude distribution; RTN amplitude distribution; amplitude distribution; current-path percolation effect; high-k gate dielectric pMOSFET; metal-gate pMOSFET; negative bias temperature stress-induced threshold voltage fluctuation; probability distribution; random telegraph noise; reaction-diffusion model; Current measurement; Logic gates; MOSFETs; Semiconductor device modeling; Semiconductor process modeling; Stress; Voltage measurement; Amplitude; negative bias temperature instability (NBTI); random telegraph noise (RTN); simulation;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2176912