DocumentCode :
140981
Title :
3D thermal medical image visualization tool: Integration between MRI and thermographic images
Author :
Abreu de Souza, Mauren ; Chagas Paz, Andre Augusto ; Sanches, Ionildo Jose ; Nohama, Percy ; Gamba, Humberto Remigio
Author_Institution :
Grad. Sch. on Electr. Eng. (CPGEI), Fed. Univ. of Technol., Curitiba, Brazil
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
5583
Lastpage :
5586
Abstract :
Three-dimensional medical image reconstruction using different images modalities require registration techniques that are, in general, based on the stacking of 2D MRI/CT images slices. In this way, the integration of two different imaging modalities: anatomical (MRI/CT) and physiological information (infrared image), to generate a 3D thermal model, is a new methodology still under development. This paper presents a 3D THERMO interface that provides flexibility for the 3D visualization: it incorporates the DICOM parameters; different color scale palettes at the final 3D model; 3D visualization at different planes of sections; and a filtering option that provides better image visualization. To summarize, the 3D thermographc medical image visualization provides a realistic and precise medical tool. The merging of two different imaging modalities allows better quality and more fidelity, especially for medical applications in which the temperature changes are clinically significant.
Keywords :
biomedical MRI; biomedical communication; biomedical optical imaging; computerised tomography; image colour analysis; image reconstruction; infrared imaging; medical image processing; 2D MRI-CT images slices; 3D THERMO interface; 3D thermographc medical image visualization tool; DICOM parameters; MRI images; color scale palettes; thermographic images; three-dimensional medical image reconstruction; Computed tomography; DICOM; Magnetic resonance imaging; Solid modeling; Three-dimensional displays; Visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944892
Filename :
6944892
Link To Document :
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