DocumentCode :
1409846
Title :
Foreword Polymeric Electronics Packaging
Author :
Morris, James E. ; Liu, Jiangchuan
Author_Institution :
State University of New York at Binghamton
Volume :
21
Issue :
2
fYear :
1998
fDate :
6/1/1998 12:00:00 AM
Firstpage :
206
Lastpage :
207
Keywords :
Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Conducting materials; Conductive adhesives; Electronics packaging; Finite element methods; In vitro fertilization; Independent component analysis; Materials science and technology; Polymers;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/TCPMA.1998.705465
Filename :
705465
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1409846
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