DocumentCode
1409951
Title
Effect of arc behaviour on material transfer: a review
Author
Chen, Zhuan-Ke ; Sawa, Koichiro
Author_Institution
Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
Volume
21
Issue
2
fYear
1998
fDate
6/1/1998 12:00:00 AM
Firstpage
310
Lastpage
322
Abstract
One of the serious problems of arcing in relays and switches is leading to material transfer, thus resulting in the loss of contact material and the early end of lifetime. Although this phenomenon has been studied for many years, there are still many unsolved problems. This paper is a review of material transfer due to arcing based on published work by the authors and by the other investigators. Included are a discussion of transfer mechanism, called particle sputtering and deposition (PSD) model; a survey of contact materials, circuit parameters, electrode temperatures, and surrounding gases which have been determined to affect arc behaviour and material transfer; the effect of contact surface temperature distribution, arc spot dimension, arc root stability, and arc duration on wearout or loss of contact material from two contacts; and an idea of balance transfer (“zero” loss) operation. It is expected that this paper could supply some basic considerations for controlling material transfer in practical applications
Keywords
circuit-breaking arcs; electrical contacts; relays; switches; wear; arc behaviour; arc duration; arc root stability; arc spot dimension; balance transfer; circuit parameters; contact materials; electrode temperatures; particle sputtering and deposition model; relays; surface temperature distribution; switches; transfer mechanism; Arc discharges; Circuits; Contacts; Electrodes; Gases; Relays; Sputtering; Surface morphology; Switches; Temperature distribution;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.705480
Filename
705480
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