• DocumentCode
    1409951
  • Title

    Effect of arc behaviour on material transfer: a review

  • Author

    Chen, Zhuan-Ke ; Sawa, Koichiro

  • Author_Institution
    Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
  • Volume
    21
  • Issue
    2
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    310
  • Lastpage
    322
  • Abstract
    One of the serious problems of arcing in relays and switches is leading to material transfer, thus resulting in the loss of contact material and the early end of lifetime. Although this phenomenon has been studied for many years, there are still many unsolved problems. This paper is a review of material transfer due to arcing based on published work by the authors and by the other investigators. Included are a discussion of transfer mechanism, called particle sputtering and deposition (PSD) model; a survey of contact materials, circuit parameters, electrode temperatures, and surrounding gases which have been determined to affect arc behaviour and material transfer; the effect of contact surface temperature distribution, arc spot dimension, arc root stability, and arc duration on wearout or loss of contact material from two contacts; and an idea of balance transfer (“zero” loss) operation. It is expected that this paper could supply some basic considerations for controlling material transfer in practical applications
  • Keywords
    circuit-breaking arcs; electrical contacts; relays; switches; wear; arc behaviour; arc duration; arc root stability; arc spot dimension; balance transfer; circuit parameters; contact materials; electrode temperatures; particle sputtering and deposition model; relays; surface temperature distribution; switches; transfer mechanism; Arc discharges; Circuits; Contacts; Electrodes; Gases; Relays; Sputtering; Surface morphology; Switches; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.705480
  • Filename
    705480